City University of Hong Kong

MSc Intelligent Semiconductor Manufacturing 理學碩士(智能半導體製造)

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Course Information

Registration period
Year-round Recruitment
Price
HKD 6,700
(Tuition Fee HK$6,700 per credit)
Study Mode
Duration
2 Year(s)
Language
Cantonese
Location
-
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Course Overview

Programme Aims and Objectives
Semiconductors are everywhere – from the processor and AI chips in our smartphones to electronic devices for electric and autonomous vehicles, to new sensors for healthcare. Training required for manufacturing and semiconductor technology is developing rapidly in a wide range of fields. Besides the semiconductor manufacturing process, the semiconductor industry is capital-intensive and must focus on realistic needs for manufacturing intelligence, including new fab construction, technology migration, capacity transformation and expansion, tool procurement, and outsourcing. Recently, semiconductor manufacturing has also become a global geopolitical battleground. Thus, there is a need for professional education to train engineers in Hong Kong and mainland China to acquire the capabilities of intelligent and semiconductor manufacturing.

The programme is designed to provide students with knowledge/skills in process control/operations, electronic and advanced packaging technologies, and materials in intelligent and semiconductor manufacturing and its related reliability science and quality engineering. Ability to solve problems and develop new processes or equipment. Students are encouraged to participate in the projects with the companies. The objective of this programme is to prepare students who wish to pursue graduate degrees or enter the workforce in the field of the semiconductor and electronics industry.

What You’ll Learn

Programme Content

You may obtain the MSc degree by either

  1. completing taught courses only, or
  2. taught courses plus the dissertation project.

Required Core Courses (12 credit units)

  • Quality and Reliability Engineering
  • Semiconductor Manufacturing and Management
  • 3D IC Stacking and Advanced Packaging
  • Semiconductor Process Equipment and Material

Programme Electives (18 credit units)

Electives (Select any six 3-CU courses OR three 3-CU courses and a 9-CU dissertation)

  • Characterization Techniques for Semiconductor Manufacturing
  • Data Analysis and Artificial Intelligence for Systems Engineering
  • Dissertation
  • Intelligent Manufacturing for Engineering Managers
  • Packaging for Nanoelectronics
  • Process Modelling and Control
  • Project Management
  • Quality Improvement: Systems and Methodologies
  • Technological Innovation and Entrepreneurship
  • VLSI/ULSI Process Integration

For a full list of elective courses, please visit https://www.cityu.edu.hk/sye/mssm.htm

Remark: These elective courses will be offered subject to the availability of resources.



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